
Senior OSAT engineer
- Hybrid
- Hsinchu, Hsinchu, Taiwan
- integration engineering
Bring your InP/OSAT expertise to a global stage and accelerate your career in a fast-growing tech company.
Job description
SMART Photonics is a pure-play foundry of Indium Phosphide (InP) Photonic Integrated Circuits (PICs), enabling next-generation optical transceivers, coherent communication systems, sensing, and datacenter interconnect solutions. Our customers design advanced photonic chips, and SMART Photonics delivers scalable, high-quality wafer fabrication.
As our customers increasingly require backend services, including wafer finishing, assembly, packaging, and test, we are strengthening our OSAT engineering capability to ensure world-class outsourced backend manufacturing performance tailored to InP-based photonic devices.
Role Summary
We are seeking a highly skilled Senior OSAT Engineer to drive outsourced assembly and test engineering activities across SMART Photonics’ OSAT partner network. You will lead NPI readiness, yield optimization, cost improvements, and qualification activities for backend processes supporting InP-based photonic integrated circuits.
This role requires strong semiconductor backend engineering experience, hands-on problem solving, and the ability to collaborate closely with OSAT partners and cross-functional stakeholders. Experience with compound semiconductors and photonic device packaging is highly desirable.
Key Responsibilities
Lead technical engagement with the Taiwan OSAT suppliers on backend process development, testing, yield ramp, quality improvement, and volume manufacturing readiness.
Align SMART manufacturing, OSAT capabilities, and customer technical requirements for backend, testing and packaging including alignment marks, substrate thinning, back-side patterning, coating, burn-in procedures, die level testing, wire-bonding, flip-chip bonding.
Partner with Product & Integration Engineering, New Product Introduction, and Test Engineering teams on process optimization, failure analysis, and manufacturability improvements.
Monitor and proactively improve backend yield performance using data-driven analysis; identify systemic issues and lead root cause and corrective actions.
Drive new products through production release, ensuring OSAT capability meets electrical/optical/thermal/mechanical requirements for photonic integrated circuits (PIC) products.
Implement and maintain process control systems, SPC methodologies, and lean manufacturing principles at OSAT as well as support cycle time improvements.
Track supplier performance metrics (yield, DPPM, cost, cycle time, OEE) and provide updates with risk assessments and mitigation plans.
Build and maintain strong technical relationship and communication cadence with OSAT partners to ensure transparency and collaboration.
Job requirements
Qualifications
Master’s degree in Electrical Engineering, Photonics, Materials Science, or a related field.
8+ Experience working with semiconductor back-end, packaging, or OSAT environments.
Experience with OSAT manufacturing environments for InP-based products including wafer finishing, packaging, testing, and burn-in.
Strong technical understanding of backend manufacturing flows for optoelectronic semiconductor devices: wafer thinning, coating, singulation, wire bonding, fiber attach, optical assembly, electro-optical test, burn-in, reliability stress and analysis.
Proven ability to analyse backend-related yield and reliability, to drive engineering decisions and improvements.
Strong coordination and communication skills, with the ability to work across teams and cultures. Structured, responsible, and detail-oriented working style.
Fluent in Mandarin; professional working proficiency in English.
Nice to have Experience
Hands-on experience with InP or other III-V semiconductor optical device backend processing
Experience supporting Taiwanese semiconductor manufacturing or supply chain environments.
Familiarity with qualification and reliability standards in telecom/datacom (e.g., Telcordia GR-468).
Experience with new product introduction (NPI) and manufacturing scale-up.
What We Offer
Opportunity to work with advanced photonic technology in a global environment.
A professional culture that values reliability, mutual respect, and long-term collaboration.
Meaningful responsibility and the opportunity to grow together with our Taiwan operations.
We welcome candidates who value professional collaboration, technical excellence, and long-term partnership building.
We are open to flexible engagement models, including an independent contractor arrangement, collaboration with a local Taiwanese business partner, or direct employment in line with local Taiwan labour practices and regulations.
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