Senior Integration Engineer – Photonics Packaging & Backend

Introduction 

Join SMART Photonics B.V., a leading Indium Phosphide (InP) photonic foundry, where we work closely with customers to turn innovative ideas into high-performance photonic integrated circuits (PICs). 

As demand for backend services, including wafer finishing, assembly, packaging, and testing, continues to grow, we are expanding our Product & Integration Engineering (PIE) team with expertise in packaging and reliability. This team plays a crucial role in bridging frontend wafer fabrication with internal backend processes and reliability testing as well as with backend, packaging and testing executed with external partners.

Your role: 

As a Senior Integration Engineer, you will be at the center of this effort, ensuring seamless integration across the full value chain, with a strong focus on packaging and reliability. You act as a key technical link between internal teams and external partners, driving alignment, manufacturability, and performance of our integrated photonic products. 

• Serve as the subject matter expert on backend processes, packaging, and reliability requirements for PICs, resolving integration challenges across the value chain 

• Collaborate with Backend, New Product Introduction (NPI), Test, and Reliability Engineering teams, as well as external partners, to drive process optimization, failure analysis, and manufacturability improvements 

• Analyze reliability data and link it to in-line and end-of-line (EOL) metrics to enable early issue detection, continuous improvement, and yield enhancement 

• Establish Design-for-Packaging and Design-for-Reliability (DfX) guidelines, translating backend and reliability learnings into design rules and PDK updates. Together with Design Enablement team ensure the implementation. 

• Drive yield improvement by connecting packaging and reliability performance with process and test data across the value chain 

• Lead integration projects, ensuring timely delivery, clear communication, and adherence to technical specifications 

• Proven experience in semiconductor manufacturing, with a focus on InP photonic integration, backend processing, PIC packaging, and/or reliability. Hands-on experience in process development, optimization, and troubleshooting. 

• A Master’s degree or PhD in Integrated Photonics, Electrical Engineering, Materials Science, Physics, or related field. 

• Demonstrated ability to analyze reliability and process data, linking in-line and end-of-line (EOL) metrics to drive yield improvement and root cause analysis 

• Experience with Design-for-Packaging and/or Design-for-Reliability (DfX), including translating learnings into design rules or PDK improvements 

• Strong communication skills to work effectively in a cross-functional team environment. 

• Familiarity with software for design of PICs such as Klayout, Nazca, Luceda or similar. 

We offer: 

• A collaborative atmosphere with talented, passionate colleagues within an open culture; 

• Personalized career development, including training and coaching opportunities. Notable trainings are JePPIX courses, Green/Black Belt in DfSS and Six Sigma or Project Management; 

• For people who need a work permit, VISA and/or relocation, we are eligible to apply for the highly skilled migrant VISA. We also have a relocation package in place. 

• Unique office perks such as chair massages, fresh fruit, fitness discounts, and Lunch Walks;